MD-2012 Automatic Lead-Free Reflow Oven (new 2012 model)

The MD-2012 uses the latest technology for mini reflow ovens, adopting infrared heating elements, thermocouples, and circulating air to maintain temperature of the reflow process. The thermal cycle high-precision accuracy is also maintained by a closed-loop microcomputer control, and the reflow progress can be observed either on the LCD display or through the glass window in front of the oven. Along with 6 predefined heating profiles, users can also use the interface operating on a Chinese-English bilingual OS to effortlessly create 2 custom profiles for non-common solder pastes and various material parameters.

The MD-2012 reflow oven's low cost for its technology and diverse functions is perfect for preheating, safe soldering, and even safe removal of SMD, BAG, and other electronic parts mounted on a PCB. The light weight and small size allows for portability, and high precision, lower energy consumption, stable performance, and long service life makes this model reliable and long-lasting. Applications of its usages can also be extended to double-sided PCB's. It's simplicity also lies in the automatic heating and reflowing process for ease of correcting bad joints, removal and replacement of bad components, and finishing engineering projects and prototypes.

Features/Specifications:
* An economical solution from single runs to on-demand small batch production
* Keypad selection and LCD display
* Uses an ergonomic design and is easy to operate
* Can select from 8 profiles (6 predefined, 2 customizable)
* Heating: infrared and hot air circulation
* Reflow process automatically completes all 4 segments (Preheat, Soak, Reflow, and Cool-down)
* Light weight and small base
* Voltage supply: 220VAC (50Hz or 60Hz)
* Max. power consumption: 1.5kW
* Max. working area: 300mm-320mm
* Temperature range: 100°C-350°C
* Reflow time: 1~8 min
* Oven weight: 12.5kg
* Oven dimension: 430mm-370mm-260mm