Intel BXSTS100C Thermal Solution LGA1366 for 2-Socket Servers/Workstations - Combo
Intel combo boxed thermal solution for 2-socket servers/workstations. Maximum CPU TDP: 130W. Combination heat sink with removable fan. For LGA1366, Nehalem Xeons.
TitleIntel BXSTS100C Thermal Solution LGA1366 for 2-Socket Servers/Workstations - Combo