HotTool T962A Infrared IC Reflow Oven BGA SMD SMT Chip Rework Reballing Machine 300 X 320MM Effective Soldering Area

Products using microcomputer control, stored in eight reflow temperature curve for users to choose, meet the standard leaded lead-free SMD, BGA welding requirements, simple operation, the entire welding process automatically. Fast infrared radiation and circulation air heating, the temperature more accurately and evenly; fuzzy control techniques and visualization workbench drawer, the entire welding process is done automatically under your surveillance; able to complete a single, double-sided welding can weld most fine surface-mount components. Uses a maintenance-free high-reliability design, allows you to use the Heart, rest assured.

Parameters

Effective Soldering max area:300 x 320mm

Process cycle:1 to 8 min

Rated power :1500W

Voltage: 110V to 240V

Frequecy: 50Hz to 60Hz

Feature:

1. Big infrared soldering area.

Effective soldering area: 300 x 320 mm.

2. Multi temperature wave selectable.

8 kinds of temperature parameter waves selectable; with manual heating function, forced cooling function, etc.

3. Unique design of temperature rise and homoeothermy.

The cooperation of fast infrared heating with output work 1500 W and homoeothermic fan makes the temperature accurate and even and the whole process automatic and accurate in accordance with the preset temperature wave. No need of extra control.

4. Comprehensive functions.

With functions of reflow soldering, drying, heat preservation, finalizing the design, fast cooling, etc.

Can solder single and double PCB panels with all kinds of encapsulation form such as CHIP, SOP, PLCC, QFP, BGA, etc.

Package Included

1-Main Heater Infrared Oven

1-Fuse (10A)

1-Power Cord

1-English Manual