Hakko Fr1418-01 Bga Rework System
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2023-10-26
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Hakko Fr1418-01 Bga Rework System

The Hakko FR-1418 BGA rework system is designed for the manual alignment and placement or removal of BGA, μBGA, CSP and other surface mount components with repeatable solder reflow profiles. The FR-1418 is constructed of heavy-walled aluminum castings for unsurpassed precision and stability and uses precisely controlled solder reflow profiles. The system features a unique gantry style construction similar to that of a pick-and-place machine, which allows the PCB to remain stationary while the head moves to accomplish the X, Y, Z and Theta alignment. The Z-axis travel and component placement is manually controlled. The bottom heater is a single zone (10 x 12 inches) large area, low mass infra-red heater that provides fast, efficient heating and eliminates board warping. The Hakko FR-1418 BGA rework system is designed for the manual alignment and placement or removal of BGA, µBGA, CSP and other surface mount components with repeatable solder reflow profiles. Gantry System   Unique gantry system allows the PCB to remain stationary while the head is manually moved to accomplish the X, Y, Z and Theta alignment. The design allows the capacity to rework boards up to 14 x 18 inches in a smaller footprint with simple board fixture. Rigid structure for stability and accurate component placement. Rapid movement handle allows fast, easy X-Y alignment along smooth motion gantry. Fine adjust with fine-threaded adjustment knobs     Board And Component Capacity   Board capacity: 2 x 2 inch minimum. 14 x 20 inch maximum

  • BrandHakko
  • EAN0641328044514
  • LabelHakko
  • ManufacturerHakko
  • MPNFR1418-01
  • NumberOfItems1
  • PackageQuantity1
  • PartNumberFR1418-01
  • ProductGroupBISS
  • ProductTypeNameELECTRONIC_COMPONENT
  • PublisherHakko
  • StudioHakko
  • TitleHakko Fr1418-01 Bga Rework System
  • UPC641328044514