EGC High-Performance Thermal Paste Compound for CPU Heatsinks - 4 Grams
EGC's High-Performance thermal compound is specifically tailored for system-builders looking to get the most thermal conductivity between their processor and heatsink/CPU fan. With 4G of high-density thermal compound you can cover nearly 30 CPU cores. Thermal compound has never been easier to apply with the included application-stick.
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