BCP Double Conductive EMI Shielding Copper Foil Tape- 1/4 Inch X 55 Yds.

Features: copper having a low surface oxygen characteristics, can be attached with a variety of different substrates, such as metal, insulating materials, etc., It has a wide temperature range. Mainly used in electromagnetic shielding and antistatic, conductive copper foil substrate surface is placed, with the metal substrate, would with excellent continuity and provide electromagnetic shielding effect.
Technical Data
Carrier: Copper Foil
Adhesive: Conductive Acrylic
Adhesive Carrier Thickness (mm): 0.018
Adhesive Thickness (mm)ïš0.035
Total Thickness (mm): 0.055±0.005
Initial Tack(kg/1"): 1.2
Resistance(ohm/in2): 0.05
Application Temperature: -10„ƒ-120„ƒ